
Samsung Advances Toward Nvidia Approval for Next-Generation HBM4 AI Memory
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Earnings Reveal Intensifying Battle Between Samsung and SK Hynix for AI Memory Leadership
Quarterly results from South Korea’s top memory makers framed a high-stakes competition to capture AI-focused memory demand, with companies shifting product mix toward HBM and advanced DDR while managing margin pressure in commodity lines. Recent industry moves — including Samsung’s reported progress toward Nvidia sign‑off for next‑gen HBM and competitors’ large capex commitments — add supply and qualification dynamics that will shape pricing, capacity and customer allocations in coming quarters.

Japan–U.S. tie-up: SoftBank’s Saimemory and Intel race to commercialize next‑gen AI memory
SoftBank’s Saimemory and Intel launched the Z‑Angle Memory (ZAM) program to develop DRAM optimized for AI with prototypes due by the fiscal year ending March 31, 2028 and a commercialization target in fiscal 2029. The initiative arrives as major memory suppliers accelerate HBM and NAND investments and hyperscalers exert greater influence on qualification cycles—factors that both validate demand for ZAM’s energy‑focused approach and raise competitive and timing risks.


